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Tolerating Soft Errors in Processor Cores Using CLEAR (Cross-Layer Exploration for Architecting Resilience)

机译:使用CLEaR(跨层)容错处理器内核中的软错误   探索建筑复原力

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摘要

We present CLEAR (Cross-Layer Exploration for Architecting Resilience), afirst of its kind framework which overcomes a major challenge in the design ofdigital systems that are resilient to reliability failures: achieve desiredresilience targets at minimal costs (energy, power, execution time, area) bycombining resilience techniques across various layers of the system stack(circuit, logic, architecture, software, algorithm). This is also referred toas cross-layer resilience. In this paper, we focus on radiation-induced softerrors in processor cores. We address both single-event upsets (SEUs) andsingle-event multiple upsets (SEMUs) in terrestrial environments. Our frameworkautomatically and systematically explores the large space of comprehensiveresilience techniques and their combinations across various layers of thesystem stack (586 cross-layer combinations in this paper), derivescost-effective solutions that achieve resilience targets at minimal costs, andprovides guidelines for the design of new resilience techniques. Our resultsdemonstrate that a carefully optimized combination of circuit-level hardening,logic-level parity checking, and micro-architectural recovery provides a highlycost-effective soft error resilience solution for general-purpose processorcores. For example, a 50x improvement in silent data corruption rate isachieved at only 2.1% energy cost for an out-of-order core (6.1% for anin-order core) with no speed impact. However, (application-aware) selectivecircuit-level hardening alone, guided by a thorough analysis of the effects ofsoft errors on application benchmarks, provides a cost-effective soft errorresilience solution as well (with ~1% additional energy cost for a 50ximprovement in silent data corruption rate).
机译:我们提出了CLEAR(架构弹性的跨层探索),这是同类框架中的第一个框架,它克服了设计中对可靠性失败具有弹性的数字系统的主要挑战:以最小的成本(能源,电力,执行时间,面积)实现所需的弹性目标),通过在系统堆栈的各个层(电路,逻辑,体系结构,软件,算法)结合弹性技术。这也称为跨层弹性。在本文中,我们专注于辐射引起的处理器内核中的软错误。我们解决了陆地环境中的单事件心烦(SEU)和单事件多心烦(SEMU)。我们的框架自动而系统地探索了综合弹性技术的大空间及其在系统堆栈各层之间的组合(本文中为586个跨层组合),得出了具有成本效益的解决方案,以最小的成本实现了弹性目标,并为新的设计提供了指南弹性技术。我们的结果表明,电路级强化,逻辑级奇偶校验和微体系结构恢​​复的精心优化组合为通用处理器内核提供了极具成本效益的软错误恢复解决方案。例如,无序内核的无声数据损坏率提高了50倍,能耗仅为2.1%(无序内核为6.1%),而没有速度影响。但是,仅(应用程序感知)选择性电路级强化,在对软件错误对应用程序基准的影响进行彻底分析的指导下,也提供了一种经济高效的软错误恢复能力解决方案(将能耗提高约1%,从而使无声性能提高了50倍)数据损坏率)。

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